Products

Tin Plating Additives

Tin Additive

Product Name Application Feature
MTHS ▪ Lead-free high speed semi-bright plating
▪ Additive for Reel-to-Reel line
▪ Excellent Solderability & Throwing power
▪ Very stable deposits on high current densities
MSN-2000 ▪ Lead-free high speed semi-bright plating
▪ Additive for Reel-to-Reel line
▪ Excellent Solderability & Throwing power
▪ Very stable deposits on high current densities

Neutral pH Additive

Product Name Application Feature
LF-500 ▪ Various Chip plating ▪ Excellent Solderability & Throwing power
▪ Very stable all over wide range of current densities

Immersion Tin Plating Process

Product Name Application Feature working conditions
M/U Temp. Time
ITP-1000 ▪ Immersion tin ▪ Dense and uniform deposit structure
▪ Higher deposit thickness upto 1.5um(0.4-1.5μm)
▪ Excellent bath stability and solderability
▪ Inhibition of whisker formation
▪ No solder-mask aggression
▪ Easy control
100%V 60-70℃ 5-25min