Products
Tin Plating Additives
Tin Additive
| Product Name | Application | Feature |
|---|---|---|
| MTHS |
▪ Lead-free high speed semi-bright plating ▪ Additive for Reel-to-Reel line |
▪ Excellent Solderability & Throwing power ▪ Very stable deposits on high current densities |
| MSN-2000 |
▪ Lead-free high speed semi-bright plating ▪ Additive for Reel-to-Reel line |
▪ Excellent Solderability & Throwing power ▪ Very stable deposits on high current densities |
Neutral pH Additive
| Product Name | Application | Feature |
|---|---|---|
| LF-500 | ▪ Various Chip plating |
▪ Excellent Solderability & Throwing power ▪ Very stable all over wide range of current densities |
Immersion Tin Plating Process
| Product Name | Application | Feature | working conditions | ||
|---|---|---|---|---|---|
| M/U | Temp. | Time | |||
| ITP-1000 | ▪ Immersion tin |
▪ Dense and uniform deposit structure ▪ Higher deposit thickness upto 1.5um(0.4-1.5μm) ▪ Excellent bath stability and solderability ▪ Inhibition of whisker formation ▪ No solder-mask aggression ▪ Easy control |
100%V | 60-70℃ | 5-25min |